Doosan has set its sights on Europe, betting that high-performance copper clad laminates built for AI accelerators and optical modules will unlock new business across the continent. The Korean firm unveiled its latest electronic materials lineup at Electronica 2026, which runs Nov. 10 to 13 in Munich, Germany.
Europe’s biggest trade fair for electronic components and systems draws roughly 3,500 exhibitors from about 60 nations this year. The event runs parallel to SEMICON Europa, creating a dense concentration of semiconductor, automotive, PCB, display and sensor specialists. For Doosan, the timing aligns with surging demand for AI data center infrastructure and next-generation vehicle electronics.
At its booth, Doosan features CCL products designed for AI servers, semiconductor packaging, automotive systems, smart devices and 5G/6G networks. CCL serves as the foundation for printed circuit boards, and its electrical, thermal and mechanical characteristics directly shape end-product performance.
The company puts special emphasis on CCL for AI accelerators and optical modules. These materials deliver low dielectric constant and low dielectric loss, enabling rapid signal transmission with minimal energy waste in high-speed data environments.
Meanwhile, Doosan also showcases patterned flat cable used in electric vehicle battery packs. PFC connects individual battery cells and slashes weight and volume by more than 80 percent compared to traditional copper wiring. Doosan claims the world’s first continuous roll-to-roll manufacturing process for PFC, producing components up to 2.5 meters long.
A 5G antenna module rounds out the display. It consolidates signal transmission, reception and frequency conversion into one component for beamforming repeaters.
Company officials say they will fold market trends and customer feedback gathered in Munich into future development work while pursuing follow-up discussions to lock in new European accounts.
