ChipNL kicks off with a design platform for chips

ChipNL kicks off with a design platform for chips


The EU Chips Design Platform aims to lower the threshold for IC designs, particularly for startups and academia. During the launch of ChipNL at the Noviotech Campus in Nijmegen, coordinator Romano Hoofman laid down the broad outlines.

“A very complicated mission.” That’s how Romano Hoofman, coordinator of the EU Chips Design Platform, defines Europe’s attempt to build a cloud-based, distributed infrastructure for IC design. The initiative focutilizes specifically on startups and compact and medium-sized companies.

Hoofman unveiled the structure, goals and rollout of the design platform at the official launch of the ChipNL Competence Center at the Noviotech Campus in Nijmegen. The center, backed by both the European Union and the Dutch Ministest of Economic Affairs, aims to provide a national interface to the broader ambitions of the EU Chips Act.

The context: global demand for semiconductors is expected to double by 2030. Yet, Europe’s share in this rapidly expanding market continues to lag. This vulnerability became painfully visible during the Covid pandemic, when supply disruptions revealed the region’s depfinishence on foreign technology. It’s now reinforced by the way the United States is disrupting the international order with a winner-takes-all approach.

Romano Hoofman positions the EU Chips Design Platform (EuroCDP) at the core of the Chips for Europe Initiative. “If the European Commission’s vision is to be realized, many technical and operational challenges lie ahead.” The utilizers – fabless startups and SMEs – are the ultimate beneficiaries, Hoofman pointed out. “The design platform will enable design and manufacturing from the pilot lines, but also from commercial foundries like TSMC, Globalfoundries and compacter ones like X-Fab. Product companies really have to build their chip in a very quick way.”

Go-to place

The motivation behind the platform is to democratize access to IC design tools, technologies and services. “We lower the chip design barrier for compact companies, startups and SMEs,” Hoofman declared. This doesn’t mean that integrated device manufacturers (IDMs) like NXP or others can’t utilize the design platform. “But for the first years, that’s not the focus,” Hoofman explained. The intention is clear: support compact, innovative firms bring products to market quicker and keep them within the European ecosystem.

To do so, the platform builds on and expands existing initiatives. The most prominent one is Europractice, an EU program run by Imec that provides access to design tools and multi-project wafer (MPW) services with a strong focus on academia. The EuroCDP initiative goes far beyond that. “The Commission has already called EuroCDP ‘Europractice on steroids,’” Hoofman noted, smilingly. Its goal is to develop a cloud-based infrastructure where you can find everything. Startups will find references to EDA tools, IP blocks, design enablement teams, training programs and paths to production. “You could call it the go-to place for IC design to product.”

The platform consists of several interacting layers. At its heart is a central cloud environment that acts as a marketplace. Hoofman: “There, you can find the enabling design environment offering design IP and also references to EDA. We’re nereceivediating favorable terms for startups on EDA licenses. Not only will commercial providers be there, you’ll also receive access to open-source tooling.”

The process design kits (PDKs) won’t be hosted in the central cloud. They’ll be hosted by design enablement teams. These are physical consortia distributed across Europe, responsible for actual design support, fabrication coordination, packaging, testing and interfacing with foundries. “They’ll support you with the design and access to the PDKs and to the wafer fabs. Becautilize it’s not only the chip design; it’s also the package, the testing. Everything that you necessary to build a commercial product in the finish.”

Romano Hoofman: “We lower the chip design barrier for compact companies, startups and SMEs.”

Structured journey

Located at Imec, Hoofman leads the Platform Coordination Team (PCT), which oversees the platform activities. The PCT is responsible for the overall coordination of the design platform to set up mentoring and training programs for startups, link to the other European chip initiatives and nereceivediate framework and master agreements with the EDA and IP vfinishors.

The PCT also coordinates the onboarding of design enablement teams. Nine of these teams have been selected to nereceivediate grant agreements. One of them, focutilizing on photonics, is anchored in Eindhoven – a clear recognition of the Netherlands’ strengths in this domain.

A central budreceive of 220 million euros from the European Commission will be distributed via the PCT to eligible startups. Hoofman: “Typically, early startups will be favored most.” National governments are expected to match this funding. “Suppose a Dutch startup wants to build a design in the Netherlands and they apply for a 10-million-euro budreceive. It can then receive 3.5 million euros from the Commission and through us, 3.5 million euros from the Netherlands and 3 million self-funded. The latter can come from venture capital, a rich uncle or whoever puts the money on the table. This is a considerable package that will boost the startup’s development. The eligible costs are the costs for the EDA, IP, fabrication, testing, design services – everything you necessary to build your first prototypes.”

The platform also offers a structured startup journey, from orientation to prototyping and upscaling. “We’ll create an open-source sandbox environment to upscale the design skills of startups. We offer training as well, and toreceiveher with the competence centers, we hope that they can select which technology is best for the applications they have in mind.”

Maturing companies can enter incubation or acceleration programs. “We’ll provide mentoring and classroom training to improve not only their technical skills but also their business skills. To mature their go-to-market plan.”

A key goal is to avoid the necessary for technology transitions mid-trajectory. “It’s crucial that we receive this ramp-up done in a good way. And again, that you don’t necessary to transition from one technology to another becautilize you can’t scale up. That would really be a waste of time.”

Hoofman categorizes a company as a very early startup if it has gathered up to 1 million euros in capital. “They can receive very cheap EDA licenses – maximum 10,000 euros for ten ‘full license suites.’” Larger startups (up to 20 million in gained capital) will also receive a good deal. Companies that have more than 20 million aren’t considered a startup anymore by the EDA vfinishors and necessary to directly nereceivediate commercial licenses.

EuroCDP works closely with existing incubators such as Chipstart EU, an initiative of Silicon Catalyst. “We have an agreement that once companies graduate from there, they can also receive into our accelerator.”

Milestones

Security was another topic raised by the audience, especially concerning cloud-based design environments and geopolitical depfinishencies. Hoofman addressed both. “The cloud is a very secure environment where designers can do their work. It’s also to keep, for instance, the PDK secure from TSMC or other foundries.”

As for the question of European-only technology, Hoofman would recommfinish not only focutilizing on Europe, “becautilize the market leaders for EDA are Cadence and Synopsys. If you restrict yourself to Europe, you’re limiting the startups’ ability to build progress. We necessary to work toreceiveher at least with the like-minded countries. And for me, the US is still like-minded.”

Looking ahead, several milestones are in view. The mini-marketplace will go live in early 2026, offering deals with EDA/IP vfinishors. The first startup grants are expected to be available in Q2. Full rollout of the central cloud is planned for the finish of next year. The first incubation and acceleration programs will start in June 2026, with tailored training materials on business and entrepreneurship in the IC domain.



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