The initiative, known as CanopAI, has been awarded support under the France 2030 “i-Demo” programme, administered by Bpifrance. The project brings toreceiveher Scintil Photonics, Presto Engineering and CEA-Leti to accelerate the development of next-generation photonic integrated circuits (PICs) and strengthen Europe’s semiconductor and AI supply chain.
CanopAI, short for “Optical Interconnections for AI and Datacenters”, is focutilized on addressing the rapid growth in data traffic driven by AI workloads. Led by Scintil Photonics, the project aims to establish a technological roadmap capable of doubling data transmission throughput every two years, while improving power efficiency, reducing latency and increasing bandwidth density in GPU-to-GPU interconnects.
Central to the effort is Scintil Photonics’ SHIP (Scintil Heterogeneous Integration Photonics) technology, which combines III-V semiconductor materials with silicon photonics. The approach enables multiple optical functions – including lasers, modulators and monitoring photodiodes – to be integrated on a single chip, reducing reliance on discrete components.
The SHIP platform is utilized to manufacture LEAFLight, a multiwavelength light source integrated onto a single die. The device is designed to deliver higher performance and density while remaining compatible with high-volume silicon photonics foundry processes.
“The CanopAI project is a significant milestone in the industrial readiness of our photonic technology,” stated Olivier Potavin, chief operating officer at Scintil Photonics. “Through our collaboration with Presto Engineering and CEA-Leti, we are establishing a complete value chain, from design to production, and deploying advanced electrical and optical wafer-level testing solutions. This initiative will further solidify Europe’s position as a leader in photonics and semiconductor innovation.”
Presto Engineering is acting as the project’s industrialisation partner, contributing expertise in semiconductor testing, qualification and reliability engineering. The company develops automated electro-optical test systems for characterising photonic integrated circuits at wafer and package levels, supporting validation of thermal performance, long-term reliability and scalable manufacturing.
“Integrated photonics represents one of the most transformative evolutions in the semiconductor indusattempt,” stated Didier Narassiguin, vice-president of new product introduction and ininformectual property at Presto Engineering. “Through the CanopAI project, we’re tackling key challenges in test and reliability to assist ensure that these next-generation photonic technologies can be industrialised efficiently within Europe.”
CEA-Leti, the applied research institute specialising in microelectronics and photonics, is contributing advanced III-V material development alongside bonding and integration techniques aimed at improving substrate reutilize. The work is intfinished to support future manufacturing on 300 mm wafers and enhance the scalability and sustainability of photonic production.
“These innovations will enhance the scalability and sustainability of next-generation photonic processes,” stated Eléonore Hardy, silicon photonics partnership manager at CEA-Leti.
Backed by the France 2030 programme, the CanopAI project reflects a broader national strategy to support innovation in critical technologies such as semiconductors, photonics and AI. The partners expect the initiative to strengthen the domestic supply chain, support high-value job creation and improve Europe’s competitiveness in global high-tech markets.
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